State-of-the-art equipment from Japan and advanced multi-line cutting technique are applied to guarantee high cutting efficiency and evenness of quality and thickness on wafers . We can also carry out wafer processing in various sizes and thicknesses for clients according to their requirements.
ITEM
|
PARAMETER
|
|
Spec |
125mm×125mm
|
156mm×156mm
|
Type
|
P
|
|
Dimension
|
125±0.5mm
|
156±0.5mm
|
Diameter
|
150±0.5mm
|
165±0.5mm
|
Thickness
|
220±15μm
|
|
Minority carrier time
|
≥10μs
|
|
Resistivity
|
0.5~3Ω·cm , 3~6Ω·cm
|
|
Cutting method
|
Wire-cutting
|
|
Crystal orientation
|
(100) ±3°
|
|
|